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Printed circuit boards · Export ready

Printed Circuit Boards (PCB)

15 product lines covering backplanes, line cards, server and antenna boards, HDI, hybrid, heavy-copper and metal-backed PCBs — up to 64 layers, 3–12 oz copper, blind/buried vias, back-drilling, PTFE and ceramic-filled materials, cavity and step boards.

2 – 64 layersHeavy copper 3–12 ozHDI · blind/buried viasBack-drillingPTFE / ceramic filledMetal-backed
Product TypesApplications

Product TypesBoard families, from backplanes and line cards to HDI, hybrid, heavy-copper and metal-backed PCBs.

Backplane (BP)

Backplane (BP)

Large-format, high-layer-count backplanes for high-speed interconnection in communication and server racks.

  • 类型/Type: 背板 Backplane
  • 工艺/Craft: 高层数通孔、背钻、混压
Line Card (LC)

Line Card (LC)

Printed circuit boards for line cards and daughter cards in communication equipment.

  • 类型/Type: 线卡 Line Card
  • 工艺/Craft: 多层通孔、HDI、背钻
Server Board

Server Board

Boards for server mainboards and compute boards — up to 40-layer through-hole, up to 24 x 42 inch panel size.

  • 层数/Layers: 最高 40 层
  • 尺寸/Size: 最大 24×42 英寸
Antenna Board (ANT)

Antenna Board (ANT)

RF boards for base-station antennas, filters and power amplifiers; PTFE and ceramic-filled materials.

  • 类型/Type: 射频天线板
  • 材料/Material: PTFE / 陶瓷填充
HDI Board

HDI Board

High-density interconnect boards with blind/buried vias and fine-line capability for compact, high-performance devices.

  • 类型/Type: HDI
  • 工艺/Craft: 盲埋孔、多次压合
Hybrid PCB

Hybrid PCB

Multi-material hybrid boards — FR4 / PTFE / ceramic, full-surface or local lamination.

  • 类型/Type: 混压 Hybrid
  • 工艺/Craft: 多材质混压 / 局部混压
Metal-backed PCB / Heat Sink

Metal-backed PCB / Heat Sink

Metal-backed (heat-sink) PCBs for high-power devices: copper block bonding, embedded copper, post-bonding.

  • 类型/Type: 金属基板
  • 工艺/Craft: 铜块粘接 / 埋嵌铜块
Heavy Copper PCB

Heavy Copper PCB

Heavy copper PCBs, 3 oz to 12 oz copper, up to 20 layers, for high-current and power applications.

  • 铜厚/Copper: 3 oz ~ 12 oz
  • 层数/Layers: 最高 20 层

ApplicationsBoard technologies by end application, with the layer counts, copper weights and processes each one uses.

Automotive PCB

Automotive PCB

Automotive electronics: braking, steering, powertrain, e-motor, battery management, inverters, ADAS, body electronics, infotainment and navigation.

  • 层数/Layers: 双面 ~ 十二层通孔板
  • 工艺/Craft: 机械盲孔、HDI、HF/RF 混压、半折弯、3~6 oz 厚铜、嵌陶瓷、嵌铜块
Power Supply PCB

Power Supply PCB

Power supply equipment: DC-DC converters and high-end equipment / computer power supplies.

  • 铜厚/Copper: 3 oz ~ 12 oz
  • 层数/Layers: 最高 20 层
Computer & Server PCB

Computer & Server PCB

High-end servers and industrial computers: up to 40-layer through-hole boards, panel size up to 24 x 42 inch.

  • 层数/Layers: 最高 40 层
  • 尺寸/Size: 最大 24×42 英寸
Telecom Infrastructure PCB

Telecom Infrastructure PCB

Wireless telecom infrastructure: base stations (4G / 5G / WiMax / LTE), antennas, filters and power amplifiers.

  • 层数/Layers: 2 ~ 64 层
  • 工艺/Craft: 盲埋孔、HDI、背板、线卡/子卡、背钻、铜块粘接散热、PTFE/陶瓷填充、凹槽/阶梯槽、多材质混压、埋容
Core Network PCB

Core Network PCB

Core network (wired): high-end routers, switches and storage for cloud computing.

  • 层数/Layers: 背板最高 64 层
  • 工艺/Craft: HDI、背钻
Semiconductor Test PCB

Semiconductor Test PCB

Semiconductor: custom designs for chip makers, emulators, ATE test, burn-in test, wafer test carrier boards and probe-card carriers.

  • 工艺/Craft: 多次压合、HDI、POFV(VIPPO)、背钻
  • 层数/Layers: 14 层及以上通孔板卡
Industrial PCB

Industrial PCB

Industrial: motion control, temperature and humidity control, factory automation, construction machinery and office equipment.

  • 层数/Layers: 双面 ~ 十六层通孔板
  • 工艺/Craft: 机械盲孔、HDI、半折弯、3~6 oz 厚铜